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| product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays . 1/18 datashee t tsz02201-t2t0an00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.oct.2012 rev.001 tsz22111 ? 14? 001 www.rohm.com automotive regulator ultra low quiescent current ldo regulator bd7xxl5fp-c general description the bd7xxl5fp-c series are low quiescent regulators featuring 50v absolute ma ximum voltage, and output voltage accuracy of 2 , 500ma output current and 6 a (typ.) current consumpti on. there regulators are therefore ideal for applicat ions requiring a direct connection to the battery and a low current consumption. ceramic capacitors can be used for compensation of the output capacitor phase. furthermore, these ics also feature overcurrent protection to protect the device from damage caused by short-circuiting and an integrated thermal shutdown to protect the device from overheating at overload conditions. features ? ultra low quiescent current: 6.0 a (typ.) ? output current capability: 500ma ? high output voltage accuracy: 2 ? low saturation voltage by using pmos output transistor. ? integrated overcurrent prot ection to protect the ic from damage caused by output short-circuiting. ? integrated thermal shutdown to protect the ic from overheating at overload conditions. ? low esr ceramic capacitor can be used as output capacitor. ? to252-3 type package typical application circuits key specifications ? ultra low quiescent current: 6.0 a (typ.) ? output current capability: 500ma ? high output voltage accuracy: 2 ? low esr ceramic capacitor can be used as output capacitor packages fp: to252-3 6.50mm 9.50mm 2.50mm a pplic ations ? automotive (body, audio system, navigation system, etc.) figure 2. typical application circuits figure 1. package outlook
datasheet datasheet 2/18 tsz02201-t2t0an00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.oct.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd7xxl5fp-c ordering information b d 7 x x l 5 f p - c e 2 pin configuration pin description block diagram pin no. pin name function 1 vcc supply voltage input pin 2 n.c. n.c. 3 vout output pin fin gnd gnd prereg vref driver ocp gnd(fin) vcc(1pin) n.c. vout(3pin) tsd figure 3. pin configuration figure 4. block diagram n.c. terminals are not need to connect to gnd. package fp: to252-3 taping e2: reel-wound embossed tamping output voltage 33: 3.3v 50: 5.0v 1 2 3 to252-3 (top view) datasheet datasheet 3/18 tsz02201-t2t0an00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.oct.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd7xxl5fp-c absolute maximum ratings ta=25 parameter symbol ratings unit supply voltage *1 vcc -0.3 to +50.0 v power dissipation *2 pd 1.2 w operating temperature range topr -40 to +125 c storage temperature range tstg -55 to +150 c maximum junction temperature tjmax 150 c *1 pd should not be exceeded. *2 9.6mw/ reduction when ta R 25 if mounted on a glass e poxy board of 70mm70mm1.6mm. operating conditions -40 < ta < +125 bd733l5fp-c parameter symbol min. max. unit supply voltage *3 vcc 4.17 45.0 v startup voltage *4 vcc 3.0 - v output current iout 0 500 ma bd750l5fp-c parameter symbol min. max. unit supply voltage *3 vcc 5.6 45.0 v startup voltage *4 vcc 3.0 - v output current iout 0 500 ma *3 for output voltage, refer to the dropout voltage corresponding to the output current. this condition is 200ma load. *4 when iout=0ma electrical characteristics (bd733l5fp-c) unless otherwise specified ,-40 < ta < +125c,v cc=13.5v, iout=0ma, reference value: ta=25c parameter symbol limit unit conditions min. typ. max. quiescent current ib - 6 15 a output voltage vout 3.23 3.30 3.37 v 8v datasheet datasheet 5/18 tsz02201-t2t0an00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.oct.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd7xxl5fp-c bd733l5fp-c reference data unless otherwise specified: -40 < ta < +125c, vcc=13.5v, iout=0ma figure 9. dropout voltage figure 11. total supply current vs. load figure 12. thermal shutdown (output voltage vs. temperature) figure 10. ripple rejection (ein=1vrms,iout=100ma) 0 1 2 3 4 5 6 100 120 140 160 180 200 ambient temperature : ta[] output voltage : vout[v ] 0 0.2 0.4 0.6 0.8 1 1.2 0 50 100 150 200 250 300 350 400 450 500 output current : iout[m a] dropout : vd[v] 0 2 4 6 8 10 12 14 16 18 20 0 40 80 120 160 200 output current : iout[ma] circuit current : lb[ a] -40 25 125 0 10 20 30 40 50 60 70 80 90 10 100 1000 10000 100000 frequency : f[hz] ripple rejection : r.r.[db] . -40 25 125 datasheet datasheet 6/18 tsz02201-t2t0an00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.oct.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd7xxl5fp-c bd733l5fp-c reference data unless otherwise specified: -40 < ta < +125c, vcc=13.5v, iout=0ma 4 5 6 7 8 9 10 -40 -25 -10 5 20 35 50 65 80 95 110 125 ambient temperature : ta[ ] circuit current : lb[ a] figure 13. output voltage vs. temperature fi gure 14. quiescent current vs. temperature 3.280 3.285 3.290 3.295 3.300 3.305 3.310 3.315 -40 0 40 80 120 ambient temperature : ta[ ] output voltage : vout[v] . datasheet datasheet 7/18 tsz02201-t2t0an00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.oct.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd7xxl5fp-c bd750l5fp-c reference data unless otherwise specified: -40 < ta < +125c, vcc=13.5v, iout=0ma figure 15. quiescent current figure 16. output voltage vs. supply voltage figure 17. output voltage vs. supply voltage iout=100ma figure 18. output voltage vs. load 0 1 2 3 4 5 6 7 8 0 1020304050 su ppl y vol tage : vc c [v] output voltage : vout[v] . -40 25 125 0 1 2 3 4 5 6 7 8 0 300 600 900 1200 1500 output current : iout[ma] output voltage : vout[v] . -40 25 125 0 10 20 30 40 50 60 70 80 90 100 0 1020304050 supply voltage : vcc[v] circuit current : lb[a] -40 25 125 0 1 2 3 4 5 6 7 8 0 1020304050 supply voltage : vcc[v] output voltage : vout[v] . -40 25 125 datasheet datasheet 8/18 tsz02201-t2t0an00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.oct.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd7xxl5fp-c bd750l5fp-c reference data unless otherwise specified: -40 < ta < +125c, vcc=13.5v, iout=0ma figure 19. dropout voltage figure 20. ripple rejection (ein=1vrms,iout=100ma) figure 21. total supply current vs. load figure 22. thermal shutdown (output voltage vs. temperature) 0 1 2 3 4 5 6 7 8 100 120 140 160 180 200 ambient temperature[ ] output voltage : vout[v] . 0 2 4 6 8 10 12 14 16 18 20 0 40 80 120 160 200 output current : iout[m a] circuit current : lb[a] -40 25 125 0.0 0.4 0.8 1.2 0 50 100 150 200 250 300 350 400 450 500 output current : iout[ma] dropout voltage : vd[v] . -40 25 125 0 10 20 30 40 50 60 70 80 90 10 100 1000 10000 100000 frequency : f[hz] ripple rejection : r.r.[db] -40 25 125 datasheet datasheet 9/18 tsz02201-t2t0an00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.oct.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd7xxl5fp-c bd750l5fp-c reference data unless otherwise specified: -40 < ta < +125c, vcc=13.5v, iout=0ma 4 5 6 7 8 9 10 -40 -25 -10 5 20 35 50 65 80 95 110 125 ambient temperature : ta[] circuit current : lb[ a] figure 23. output voltage vs. temperature fi gure 24. quiescent current vs. temperature 4.970 4.975 4.980 4.985 4.990 4.995 5.000 5.005 5.010 5.015 5.020 -40 0 40 80 120 ambient temperature : ta[ ] output voltage : vout[v ] datasheet datasheet 10/18 tsz02201-t2t0an00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.oct.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd7xxl5fp-c reference data (bd7xxl5fp-c series) to252-3 measurement setup for figure 5, 14, 15, 24 measurement setup for figure 6, 7, 12, 13, 16, 17, 22, 23 measurement setup for figure 8, 18 measurement setup for figure 9, 19 measurement setup for figure 10, 20 measurement setup for figure 11, 21 datasheet datasheet 11/18 tsz02201-t2t0an00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.oct.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd7xxl5fp-c selection of components externally connected ? vcc pin insert capacitors with a capacitance of 0.1 f or higher between the vcc and gnd pin. choose the capacitance according to the line between the power smoothing circuit and the vcc pin. selection of the capacitance also depends on the application. verify the application and allow for sufficient margins in the design. we recommend using a capacitor with excellent voltage and temperature characteristics. ? output pin capacitor in order to prevent oscillation, a capacitor needs to be placed between the output pin and gnd pin. we recommend using a capacitor with a capacitance of 4.7 f or higher. electrolytic, tantalum and ceramic capacitors can be used. when selecting the capacitor ensur e that the capacitance of 4.7 f or higher is maintained at the intended applied voltage and temperature range. due to changes in temper ature the capacitor?s capacitance can fluctuate possibly resulting in oscillation. for selection of the capacitor refer to the iout vs. esr data. the stable operation range given in the reference data is based on the standalone ic and resistive load. for act ual applications the stable operating range is influenced by the pcb impedance, input supply impedance and load impedance. therefore verification of the final operating environment is needed. when selecting a ceramic type capacitor, we recommend usi ng x5r, x7r or better with excellent temperature and dc-biasing characteristics and high voltage tolerance. also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that the actual applicat ion meets with the required specification. measurement setup to252-3 condition vcc=13.5v cin=0.1f 4.7f datasheet datasheet 13/18 tsz02201-t2t0an00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.oct.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd7xxl5fp-c refer to the heat mitigation characterist ics illustrated in figure 25. and figure 26. when using the ic in an environment of t a R 25c. the characteristics of t he ic are greatly influenced by the operating temperature, and it is necessary to operate under t he maximum junction temperature timax. figure 25. and figure 26. show the power dissipation and heat mi tigation characteristics of t he to252-3 package. even if the ambient temperature ta is at 25c it is possible that the junction temperature tj r eaches high temperatures . therefore, the ic should be operated within the power dissipation range. the following method is used to calculate the power consumption pc (w) pc(vcc vout) iout vccib power dissipation pd R pc the load current lo is obtained by operating the ic within the power dissipation range. refer to figure11. and figure21. for the ib thus, the maximum load current ioutmax for the applied voltage vcc can be calculated during the thermal design process. calculation example 1) with ta 125, vcc 13.5v, vout 3.3v (to252-3) at ta 125 with figure 26 condition, the calculation show s that ca 93ma of output current is possible at 10.2v potential difference across input and output. calculation example 2 with ta 125, vcc 13.5v, vout 5.0v (to252-3) at ta 125 with figure 26 condition, the calculation shows that ca 112ma of output current is po ssible at 8.5v potential difference across input and output. vcc : input voltage vout : output voltage iout : load current ib : bias current ishort : shorted current iout Q pd vccib vccvout iout Q 0.953 13.5 ib 8.5 iout Q 112ma (ib:6 a) iout Q 0.953 13.5 ib 10.2 iout Q93ma (ib:6 a) ja=26.0/w -38.4mv/ 25 =4.8w 125 =0.953w ja=26.0/w -38.4mv/ 25 =4.8w 125 =0.953w datasheet datasheet 14/18 tsz02201-t2t0an00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.oct.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd7xxl5fp-c application examples ? applying positive surge to the vcc pin if the possibility exists that surges higher than 50v will be applied to the vcc pin, a zenar diode should be placed between the vcc pin and gnd pin as shown in the figure below. ? applying negative surge to the vcc pin if the possibility exists that negative surges lower than th e gnd are applied to the vcc pin, a shottky diode should be place between the vcc pin and gnd pin as shown in the figure below. ? implementing a protection diode if the possibility exists that a large inducti ve load is connected to the output pin re sulting in back-emf at time of startup and shutdown, a protection diode should be placed as shown in the figure below. i/o equivalence circuits to252-3 to252-3 output terminal *inside of () shows 5v input terminal vout datasheet datasheet 15/18 tsz02201-t2t0an00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.oct.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd7xxl5fp-c operational notes 1) absolute maximum ratings exceeding the absolute maximum rating for supply voltage, operating te mperature or other parameters can result in damages to or destruction of the chip. in this event it also becomes impossible to det ermine the cause of the damage (e.g. short circuit, open circuit, etc). therefore, if any specia l mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. 2) the electrical characteristics given in this specification may be influenced by conditions such as temperature, supply voltage and external components. transient characteristics should be sufficiently verified. 3) gnd electric potential keep the gnd pin potentia l at the lowest (minimum) level under any oper ating condition. furthermore, ensure that, including the transient, none of the pin?s vo ltages are less than the gnd pin voltage. 4) gnd wiring pattern when both a small-signal gnd and a high curr ent gnd are present, single-point gr ounding (at the set standard point) is recommended. this in order to separate the small-signal and high current patterns and to ensure that voltage changes stemming from the wiring resistance and high current do not caus e any voltage change in the small-signal gnd. similarly, care must be taken to avoid wiring pattern fluct uations in any connected external component gnd. 5) inter-pin shorting and mounting errors ensure that when mounting the ic on the pcb the direction and position are correct. incorrect mounting may result in damaging the ic. also, shorts caused by dust entering betw een the output, input and gnd pin may result in damaging the ic. 6) inspection using the set board the ic needs to be discharged after each inspection process as, while using the set board for inspection, connecting a capacitor to a low-impedance pin may cause stress to the ic. as a protection from static electricity, ensure that the assembly setup is grounded and take sufficient caution with tr ansportation and storage. also, make sure to turn off the power supply when connecting and disconnecting the inspection equipment. 7) power dissipation (pd) should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 8) thermal design the power dissipation under actual oper ating conditions should be taken into consideration and a sufficient margin should be allowed for in the thermal design. on the reverse side of the package this product has an exposed heat pad for improving the heat dissipation. use both the front and reverse side of the pcb to increase the heat dissipation pattern as far as possible. the amount of heat generated depends on the voltage difference across the input and output, load current, and bias current. therefore, when actually using the chip, ensure that the gener ated heat does not exceed the pd rating. tjmax: maximum junction temperature=150 , ta: ambient temperature ( ), ja: junction-to-ambient thermal resistance ( /w), pd: power dissipation rating (w), pc: power consumption (w), vcc: input voltage, vout: output voltage, iout: load current, ib: bias current power dissipation rating pd (w) (tjmax ta ) / ja power consumption pc (w) (vcc-vout) iout vccib datasheet datasheet 16/18 tsz02201-t2t0an00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.oct.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd7xxl5fp-c 9) rapid variation in vcc voltage and load current in case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a mosfet as output transistor. although the actual appl ication might be the cause of the transients, the ic input voltage, output current and temperature are also possible causes. in case problems arise within the actual operating range, use countermeasures such as adjusting the output capacitance. 10) minute variation in output voltage in case of using an application susceptib le to minute changes to the output vo ltage due to noise, changes in input and load current, etc., use countermeasures such as implementing filters. 11) overcurrent protection circuit this ic incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 12) thermal shutdown (tsd) this ic incorporates and integrated thermal shutdown circui t to prevent heat damage to the ic. normal operation should be within the power dissipation rating, if however the rating is exceeded for a continued pe riod, the junction temperature (tj) will rise and the tsd circuit will be activated and turn all output pins off. after the tj falls below the tsd threshold the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than pr otecting the ic from heat damage. 13) in some applications, the vcc and pin potential might be re versed, possibly resulting in circuit internal damage or damage to the elements. for example, while the external ca pacitor is charged, the vcc shorts to the gnd. use a capacitor with a capacitance with less than 1000 f. we also recommend using reverse polarity diodes in series or a bypass between all pins and the vcc pin. 14) this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p/n junctions are formed at the intersection of these p layers with t he n layers of other elements to create a variety of parasitic elements. for example, in case a resistor and a transistor are connected to the pins as shown in the figure below then: the p/n junction functions as a parasitic diode when gnd > pin a for the resistor, or gnd > pin b for the transistor. also, when gnd > pin b for the transistor (npn), the parasi tic diode described above combines with the n layer of the other adjacent elements to operate as a parasitic npn transistor. parasitic diodes inevitably occur in the structure of the ic. their operation can result in mutual interference between circuits and can cause malfunctions and, in turn, physical dam age to or destruction of the chip. therefore do not employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than the (p substrate) gnd. gnd n p nn p+ p+ psub (pin b) c b e transistor (npn) (pin a ) n p nn p+ p+ resisto r parasiti c element p parasitic element (pin a) parasitic element or transisto r (pin b) gnd c b e n gnd parasitic element or transisto r datasheet datasheet 17/18 tsz02201-t2t0an00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.oct.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd7xxl5fp-c status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority application example rohm cannot provide adequate confirmation of patents. the product described in this specificatio n is designed to be used with ordinary electronic equipment or devices (such as aud io-visual equipment, office-automation equipment, comm unications devices, electrical app liances, and electronic toys). should you intend to use this product with equipment or devices which require an extremely hi gh level of reliability and the m alfunction of which would directly endanger human life (such as medical instruments, transportation equipm ent, aerospace machinery, nuclear-reacto r controllers, fuel controllers and other safety device s), please be sure to consult with our sales representative in advance. rohm assumes no responsibility for the use of any circuits described herein, convey s no license under any patent or other rig ht, and makes no representations that the circuits are free from patent infringement. datasheet datasheet 18/18 tsz02201-t2t0an00020-1-2 ? 2012 rohm co., ltd. all rights reserved. 2.oct.2012 rev.001 www.rohm.com tsz22111 ? 15? 001 bd7xxl5fp-c marking diagram (top view) physical dimension tape and reel information revision history part number marking output voltage (v) bd733l5 3.3 bd750l5 5.0 date revision changes 2.oct.2012 001 new release to252-3 to252-3 (top view) part number marking lot number datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1. before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2. all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1. if you intend to use our products in devices requirin g extremely high reliability (such as medical equipment, aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1. the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. |
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